To join the Consortium, or for more information, please contact:

Professor Lionel C. Kimerling, Consortium Director (lckim@mit.edu)
Dr. Jurgen Michel, Consortium Co-Director (jmichel@mit.edu)
Anthony Salazar, Consortium Program Manager (antho860@mit.edu)

Microphotonics Center Work Products

For more than two decades, the MIT Microphotonics Center has produced influential roadmaps and analyses that have helped guide the evolution of photonic systems, interconnection technologies, and the global supply chains that support them.

Communication Technology Roadmaps (CTR)

The Center’s roadmap work began with the Communication Technology Roadmap (CTR) in 1997, which analyzed the structure, interdependencies, and economic foundations of the emerging international photonic systems supply chain.

• CTR I addressed technology evolution during the telecommunications industry downturn, emphasizing integration, standardization, cross-market platforms, and electronic–photonic synergy.
• CTR II focused on enabling optical interconnection in high-performance computing, with attention to cost, energy efficiency, and bandwidth density.
• CTR III provided timely analysis of emerging system needs, barriers, and solution pathways as photonics adoption accelerated.

Over time, the CTR evolved from long-range planning documents into regularly updated guidance aligned with faster industry innovation cycles.

Key System-Level Focus Areas

Across these roadmaps and related publications, the Center examined critical system-level challenges, including:

• Scaling and energy limits in data centers and high-performance computing
• Copper and optical interconnect scalability across chip, package, and board levels
• On-board optical interconnection for short-reach systems
• Open system architectures and the impact of parallelism, virtualization, and software-defined networking on photonic components
  

From Roadmaps to Global Impact

This work expanded beyond analysis into manufacturing and deployment strategies through collaborations with industry organizations, helping define shared challenges across the photonics supply chain. Building on this foundation, the Integrated Photonic Systems Roadmap became the first comprehensive framework for scaling integrated photonics, later extending internationally through partnerships with leading global institutions.

Alongside these efforts, the Consortium grew in membership and influence, becoming a trusted forum for technology evaluation, strategic discussion, and coordinated progress across the information technology ecosystem.

Major Roadmaps and Frameworks

Building on its earlier roadmap work, the MIT Microphotonics Center has produced several landmark publications that have shaped how integrated photonics technologies are developed, manufactured, and scaled.

Photonic Systems Manufacturing Roadmap (PSMR)

Developed in partnership with the International Electronics Manufacturing Initiative (iNEMI), the Photonic Systems Manufacturing Roadmap identified key “grand challenges” across the photonics supply chain. This work directly informed the technical planning of the AIM Photonics Institute, connecting research innovation with manufacturing readiness.

Interconnection Hierarchy 2035

This framework redefined how system performance scaling is evaluated, shifting the focus from transistor scaling alone to heterogeneous integration across chip, package, and board levels. It provided a forward-looking view of interconnection technologies required to support future computing systems.

Integrated Photonic Systems Roadmap (IPSR)

The Integrated Photonic Systems Roadmap was the first comprehensive framework focused specifically on the scaling of integrated photonics technologies, addressing system-level integration across devices, packaging, and manufacturing.

Integrated Photonic Systems Roadmap – International (IPSR-I)

The IPSR-I expanded the original Integrated Photonic Systems Roadmap into an international framework through collaborations with PhotonDelta (Netherlands) and the University of Tokyo (Japan). These international editions reflect a global perspective on the development, manufacturing, and deployment of integrated photonic systems.

IPSR-I (2020) — First international edition, establishing a shared global roadmap

IPSR-I (2023) — Updated edition incorporating new technical insights and international contributions

FLAGSHIP RESEARCH PROGRAMS

Flagship Research Programs create teams comprised of MIT faculty with industry collaborators to establish world class research achievements and a vision for technology requirements. These research consortia are available to Center members for engagement in sponsored research with MIT faculty and Center members. The Sensor Platform Research program began is 2020.  The Electronic-Photonic Packaging Consortium (EPP) was founded in 2022.  The FUTUR-IC Research Alliance for Sustainable Microchip Manufacturing was established in 2023.

ELECTRONIC-PHOTONIC PACKAGING (EPP)

The EPP facilities feature a package, test and assembly line on the fifth floor of the new MIT.nano building.  The EPP Faculty-Industry research teams address vertically integrated solutions for standard package platforms; E-P package-level design automation; heterogeneous chip architectures; and materials, processes, and tools for scaling throughput/yield, bandwidth density and sensor sensitivity/selectivity. EPP is the Center’s workforce development interface for bootcamps; summer academies; and education and certification of technicians and engineers.

Join our members to participate in the next Grand Challenge study: “EPIC Technology 2035”

Charter: Determine the required evolution of technologies and supply chains to enable cost-effective, high-volume implementation of electronic-photonic integrated circuits (EPICs) in communication, sensing and information processing applications.