GenTronics Phone Supply Chain Game
Learn about the cell phone life cycle as you take charge of a phone manufacturing company. Gain an understanding of supply chain research in order…
Resources
Members Content: AIM Photonics Summer Academy 2025 Lecture Series
Microphotonics Center members can enjoy access to the AIM Photonics Summer Academy 2025 Lecture Series. Explore course content ranging from Resource Efficiency and Life Cycle…
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
In this paper, MIT researchers provide an overview and comparison of devices used for optical waveguide-to-waveguide coupling including inter-chip edge couplers, grating couplers, free form…
Graded index couplers for next generation chip-to-chip andfiber-to-chip photonic packaging
The transition towards designs which co-package electronic and photonic die together in data cen ter switch packages has created a scaling path to Petabyte per…
Members content: New PIPD Course Available to Microphotonics Center Members
Microphotonics Center members can enjoy early access to the latest course on Passive Integrated Photonics Devices (PIPD). This exclusive members’ content includes all course material, including lecture videos with embedded slides and Virtual Manufacturing Laboratory (VM Lab) content to accompany each chapter.
High density vertical optical interconnects for passive assembly
The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design,…
Hands-On Photonic Education Kits: empowering the integrated photonics workforce through practical training
The Hands-On Photonic Education (HOPE) Kits, developed with AIM Photonics, address the need for skilled workers in integrated photonics. This paper highlights the role of…
Low Loss Chip-to-Chip Couplers for High-Density Co-Packaged Optics
An experimentally demonstrated, vertical chip-to-chip evanescent coupler between silicon nitride (SiNx) and silicon (Si) is presented with the coupler loss measured to be 0.39 ± 1.06 dB at…
Have we reached the limit of computer power?
Moore’s Law states that every 1 to 2 years the number of transistors that can fit on a given size computer chip will double. Thanks…
Copper-Based Two-Dimensional Conductive Metal-Organic Framework Thin Films for Ultrasensitive Detection of Perfluoroalkyls in Drinking Water
Perfluoroalkyls (PFAS) continue to emerge as a global health threat making their effective detection and capture extremely important. Though metal-organic frameworks (MOFs) have stood out…