FUTUR-IC
Founded in 2023, FUTUR-IC is a research group that brings together scientists from across MIT, other academic institutions, and industry to understand and meet the efficiency demands of the booming microchip industry. It seeks to develop materials and component technology for high-performance resource-efficient microchip systems, drive best value chain innovation practices for resource-efficient manufacturing, and equip the workforce of the future with state-of-the-art educational content.
Adhesives Characterization for Optical Packaging (ACOP)
FUTUR-IC partners with iNEMI to address foundational gaps in electronic-photonic packaging infrastructure, developing industry-accepted characterization techniques, test vehicles, and standards for high-volume manufacturing of optical and optoelectronic systems.
Interested in becoming part of the ACOP project? Please contact Dr. Pradnya Nagarkar, Technical Program Manager (pradnyan@mit.edu) and Mr. Anthony Salazar (antho860@mit.edu).
Resources
GenTronics Phone Supply Chain Game
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
Graded index couplers for next generation chip-to-chip andfiber-to-chip photonic packaging
High density vertical optical interconnects for passive assembly
Hands-On Photonic Education Kits: empowering the integrated photonics workforce through practical training
