Photonic Integrated Circuits (PIC): Passive Device Testing 

Prof. Hu (MIT) reviews test characterization methods for passive integrated photonics components, including fiber-to-chip coupling schemes, waveguides, spirals, Mach Zehnder Interferometers, Y-splitters, ring resonators, and directional couplers. Waveguide characterization will focus on loss and dispersion measurements, and examine wavelength and polarization dependencies.  Prof. Jaime Cardenas (U of Rochester) will offer his expertise in Design for Manufacturing (DfM) and testing at a wafer-scale. Anu Agarwal (MIT) will demonstrate a specific testing application. This three-week asynchronous course will be released in December 2020.